中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

1995, vol.117, no.1 1995, vol.117, no.2 1995, vol.117, no.3 1995, vol.117, no.4

题名作者出版年年卷期
A micro-mechanics investigation on the bonding strength of heteroepitaxical film or strip on a hard substrateY. F. Luo; K. P. Rajurkar19951995, vol.117, no.3
A rubbery cure shrinkage model for analyzing encapsulated assembliesR. S. Chambers; R. R. Lagasse; T. R. Guess; D. J. Plazek; C. Bero19951995, vol.117, no.3
A study on wire sweep in encapsulation of semiconductor chips using simulated experimentsSejin Han; K. K. Wang19951995, vol.117, no.3
Application of statistical clustering to screen printing process controlV. A. Skormin; C. R. Herman; L. J. Popyack19951995, vol.117, no.3
Environmental scanning electron microscopic investigation of failure mechanisms in electronic packagesMary J. Li; Michael Pecht19951995, vol.117, no.3
Finite element viscoelastic analysis of temperature and moisture effects in electronic packagingArvind Krishna; B. D. Harper; J. K. Lee19951995, vol.117, no.3
Investigation of a heat pipe array for convective coolingA. H. Howard; G. P. Peterson19951995, vol.117, no.3
Jet-flow scavenging of a curing oven -- part I: flow visualizationK. J. Zwick; I. M. Cohen; P. S. Ayyaswamy19951995, vol.117, no.3
Jet-flow scavenging of a curing oven -- part II: numerical simulationK. J. Zwick; I. M. Cohen; P. S. Ayyaswamy19951995, vol.117, no.3
Non-Fourier heat conduction in IC chipZeng-Yuan Guo; Yun-Sheng Xu19951995, vol.117, no.3
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