中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

1999, vol.11, no.1 1999, vol.11, no.2 1999, vol.11, no.3

题名作者出版年年卷期
An evaluation of the effect of ageing on the cleanability of solder flux residuesL. Zou; M. Dusek; C. P. Hunt; B. D. Dunn19991999, vol.11, no.1
Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assemblyM. G. Firmstone; P. M. Bartholomew; D. J. J. Lowrie; S. H. Mannan; D. A. Hutt19991999, vol.11, no.1
Optimizing the reflow profile via defect mechanism analysisNing-Cheng Lee19991999, vol.11, no.1
Qualification of flip chip fluxes by wetting balance and surface insulation resistance testsAulis Tuominen; Eero Ristolainen; Ville Lehtinen19991999, vol.11, no.1
Solder joint reliability of plastic ball grid array packagesChong Hua Zhong; Sung Yi19991999, vol.11, no.1
The impact of temperature and humidity conditions on surface insulation resistance values for various fluxesChristopher Hunt; Ling Zou19991999, vol.11, no.1



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