中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024


题名作者出版年年卷期
A temperature control method of hot-bar soldering based on extended Kalman filterZeng, Min; Xie, Jianxing; Li, Zhitao; Wei, Qincheng; Yang, Hui20242024, vol.36, no.3
Electric current stressing enhanced damping properties in Sn5Sb solderLiu, Linqiang; Chen, Feng; Li, Wangyun20242024, vol.36, no.3
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraintLi, Zhenkun; Zhao, Zhili; Liu, Jinliang; Ding, Xin20242024, vol.36, no.3
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solderLiu, Fang; Wang, Zilong; Zhou, JiaCheng; Wu, Yuqin; Wang, Zhen20242024, vol.36, no.3
A study on the thermomechanical response of various die attach metallic materials of power electronicsGharaibeh, Mohammad A.; Wilde, Juergen20242024, vol.36, no.3
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling testApalowo, Rilwan Kayode; Abas, Mohamad Aizat; Ani, Fakhrozi Che; Mukhtar, Abdul Fatah Muhamed; Ramli, Mohamad Riduwan20242024, vol.36, no.3
Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applicationsShalaby, Rizk Mostafa; Saad, Mohamed20242024, vol.36, no.2
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applicationsZhao, Xinran; Pang, Yingying; Wang, Gang; Xia, Chenhui; Yuan, Yuan; Wang, Chengqian20242024, vol.36, no.2
Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testingGharaibeh, Mohammad A.; Feisst, Markus; Wilde, Juergen20242024, vol.36, no.2
Temperature and current density prediction in solder joints using artificial neural network methodLiu, Yang; Xu, Xin; Lu, Shiqing; Zhao, Xuewei; Xue, Yuxiong; Zhang, Shuye; Li, Xingji; Xing, Chaoyang20242024, vol.36, no.2
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