中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2023



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Solder joint inspection using eigensolder featuresWu, Hao; Xu, Xiangrong20182018, vol.30, no.4
Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specificationsHuang, Chien-Yi20182018, vol.30, no.4
Bonding of Si chips to low carbon steel boards using electroplated Sn solderHsu, Shou-Jen; Lee, Chin C.20182018, vol.30, no.4
Reliability studies of InnoLot and SnBi joints soldered on DBC substrateSkwarek, Agata; Illes, Balazs; Witek, Krzysztof; Hurtony, Tamas; Tarasiuk, Jacek; Wronski, Sebastian; Synkiewicz, Beata Kinga20182018, vol.30, no.4
Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solderHasnine, Md20182018, vol.30, no.4
Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wireAbdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, R.20182018, vol.30, no.3
Optimising pin-in-paste technology using gradient boosted decision treesMartinek, Peter; Krammer, Oliver20182018, vol.30, no.3
Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental studyMittal, Jagjiwan; Lin, Kwang-Lung20182018, vol.30, no.3
Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approachGharaibeh, Mohammad20182018, vol.30, no.3
Growth kinetics of IMC at the solid Cu/liquid Sn interfaceYin, Zuozhu; Sun, Fenglian; Liu, Yang20182018, vol.30, no.3
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