中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
Analytical derivation of the self-alignment motion of flip chip soldered componentsN. van Veen19991999, vol.121, no.2
Damage mechanics of surface mount technology solder joints under concurrent thermal and dynamic loadingR. Chandaroy; C. Basaran19991999, vol.121, no.2
Deformation behavior of two lead-free solders: indalloy 227 and castin alloyR. S. Whitelaw; R. W. Neu; D. T. Scot19991999, vol.121, no.2
Effect of edge and internal point support of a printed circuit board under vibrationG. H. Lim; J. H. Ong; J. E. T. Penny19991999, vol.121, no.2
Failure analysis of liquid crystal displays due to indium tin oxide breakdownT. J. Dishoungh; M. Dube; M. Pecht; J. Wyler19991999, vol.121, no.2
Failure estimation of semiconductor chip during wire bonding processT. Ikeda; N. Miyazaki; K. Kudo; K. Arita; H. Yakiyama19991999, vol.121, no.2
Integrated thermal analysis of natural convection air cooled electronic enclosureL. Tang; Y. K. Joshi19991999, vol.121, no.2
Mechanical deformation in conductive adhesives as measured with electron-beam moireE. S. Drexler; J. R. Berger19991999, vol.121, no.2
Modeling the deformation behavior of a Sn-Pb solder alloy using the simplified viscoplasticity theory based on overstress (VBO)L. Maciucescu; T. -L. Sham; E. Krempl19991999, vol.121, no.2
Natural convection cooling of vertical rectangular channels in air considering radiation and wall conductionD. A. Hall; G. C. Vliet; T. L. Bergman19991999, vol.121, no.2
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