中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2000, vol.12, no.1 2000, vol.12, no.2 2000, vol.12, no.3

题名作者出版年年卷期
Solder joint reliability of plastic ball grid array with solder bumped flip chipShi-Wei Ricky Lee; John H. Lau20002000, vol.12, no.2
TBGA reliability in telecom environmentVirpi Pennanen; Markku Tammenmaa; Tommi Reinikainen; Jiansen Zhu; Wei Lin20002000, vol.12, no.2
The impact of process parameters on gold elimination from soldered connector assembliesP. T. Vianco; A. C. Kilgo20002000, vol.12, no.2
The impact of underfill properties on the thermomechanical reliability of FCOB assemblyJicun Lu; Jianhua Wu; Yih Pin Liew; Thiam Beng Lim; Xiangfu Zong20002000, vol.12, no.2
Viscoplastic anand model for solder alloys and its applicationZ. N. Cheng; G. Z. Wang; L. Chen; J. Wilde; K. Becker20002000, vol.12, no.2
Wettability test method for surface mount technology assessmentC. C. Tu; M. E. Natishan20002000, vol.12, no.2



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