中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2000, vol.122, no.1 2000, vol.122, no.2 2000, vol.122, no.3 2000, vol.122, no.4

题名作者出版年年卷期
Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D PackagingAnh X. H. Dang; I. Charles Ume; Swapan K. Bhattacharya20002000, vol.122, no.2
A Study on Warpage of Flexible SS Substrates for Large Area MCM-D PackagingAnh X. H. Dang; I. Charles Ume; Swapan K. Bhattacharya20002000, vol.122, no.2
Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package EnvironmentPhilip M. Fabis; Henry Windischmann20002000, vol.122, no.2
Thermal Management Strategies for Embedded Electronic Components of Wearable ComputersEric Egan; Cristina H. Amon20002000, vol.122, no.2
A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) PackageSanjeev B. Sathe; Bahgat G. Sammakia20002000, vol.122, no.2
Thermal Placement Design for MCM ApplicationsYu-Jung Huang; Shen-Li Fu20002000, vol.122, no.2
Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging ModelingManjula N. Variyam; Weidong Xie; Suresh K. Sitaraman20002000, vol.122, no.2
Sodium Silicate Based Thermal Interface Material for High Thermal Contact ConductanceYunsheng Xu; Xiangcheng Luo; D. D. L. Chung20002000, vol.122, no.2
Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater ArrayWataru Nakayama; Masud Behnia; Hiroaki Mishima20002000, vol.122, no.2
Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer MoldingL. Nguyen; C. Quentin; W. Lee; S. Bayyuk; S. A. Bidstrup-Allen; S.-T. Wang20002000, vol.122, no.2
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