中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2000, vol.122, no.1 2000, vol.122, no.2 2000, vol.122, no.3 2000, vol.122, no.4

题名作者出版年年卷期
Factors Affecting the Operational Thermal Resistance of Electronic ComponentsMark R. D. Davies; Reena Cole; John Lohan20002000, vol.122, no.3
Stress Analysis of Thermal Inclusions With Interior Voids and CracksC. Q. Ru20002000, vol.122, no.3
A Damage Evolution Model for Thermal Fatigue Analysis of Solder JointsXiaowu Zhang; S.-W. Ricky Lee; Yi-Hsin Pao20002000, vol.122, no.3
Fatigue Life Analysis of Solder Joints in Flip Chip BondingYutaka Tsukada; Hideo Nishimura; Masao Sakane; Masateru Ohnami20002000, vol.122, no.3
Reliability Analysis of Flip Chip Designs Via Computer SimulationHua Lu; C. Bailey; M. Cross20002000, vol.122, no.3
A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal CyclingA. Chandra; Y. Huang; Z. Q. Jiang; K. X. Hu; G. Fu20002000, vol.122, no.3
Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau InterferometryK. Verma; B. Han20002000, vol.122, no.3
Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series SolutionJ. R. Culham; M. M. Yovanovich; T. F. Lemczyk20002000, vol.122, no.3
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic PackagesY. Kondo; H. Matsushima; T. Komatsu20002000, vol.122, no.3
LGA Connectors: An Automated Design Technique for a Shrinking Design SpaceA. Deshpande; G. Subbarayan20002000, vol.122, no.3
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