中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2000, vol.122, no.1 2000, vol.122, no.2 2000, vol.122, no.3 2000, vol.122, no.4

题名作者出版年年卷期
Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental StudyB. Han; P. Kunthong20002000, vol.122, no.4
Finite Element Analysis of Stress Singularities in Attached Flip Chip PackagesA. Q. Xu; H. F. Nied20002000, vol.122, no.4
Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect UnderfillsJohn H. Lau; S.-W. Ricky Lee20002000, vol.122, no.4
Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep AnalysisJohn H. Lau; S.-W. Ricky Lee; Chris Chang20002000, vol.122, no.4
Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into ChipsT. Elperin; A. Kornilov; G. Rudin20002000, vol.122, no.4
Thermal Management of Surface Mount Power Magnetic ComponentsG. Refai-Ahmed; M. M. Yovanovich20002000, vol.122, no.4
An Analytical Model for Time-Dependent Shearing Deformation in Area-Array InterconnectsS. M. Heinrich; S. Shakya; J. Liang; P. S. Lee20002000, vol.122, no.4
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP AssembliesReza Ghaffarian20002000, vol.122, no.4
A Simple Technique for Maximizing the Fundamental Frequency of Vibrating StructuresJ. H. Ong; G. H. Lim20002000, vol.122, no.4
Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat SinksW. W. Thrasher; T. S. Fisher; K. E. Torrance20002000, vol.122, no.4
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