中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2001, vol.123, no.1 2001, vol.123, no.2 2001, vol.123, no.3 2001, vol.123, no.4

题名作者出版年年卷期
Viscoelastic Warpage Analysis of Surface Mount PackageKiyoshi Miyake; Tsukasa Yoshida; Hyung Gil Baik; Sang Wook Park20012001, vol.123, no.2
Die Attachment for -120℃ to +20℃ Thermal Cycling of Microelectronics for Future Mars Rovers - An OverviewRandall K. Kirschman; Witold M. Sokolowski; Elizabeth A. Kolawa20012001, vol.123, no.2
Modeling Electronic Cooling Axial Fan FlowsR. Grimes; M. Davies; J. Punch; T. Dalton; R. Cole20012001, vol.123, no.2
Forced Convection Board Level Thermal Design Methodology for Electronic SystemsReena Cole; Tara Dalton; Jeff Punch; Mark R. Davies; Ronan Grimes20012001, vol.123, no.2
A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder PadsKuo-Ning Chiang; Chang-Ming Liu20012001, vol.123, no.2
Applications of a Decomposed Analysis Procedure for Area-Array PackagesTerrace B. Thompson; Ganesh Subbarayan20012001, vol.123, no.2
A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products - Part I: Theory and FormulationKrishna Darbha; Abhijit Dasgupta20012001, vol.123, no.2
A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products - Part II: Durability Analysis of Flip Chip and Chip Scale InterconnectsKrishna Darbha; Abhijit Dasgupta20012001, vol.123, no.2
Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit BoardS. A. Harman; K. D. Cole20012001, vol.123, no.2



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