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期刊

ISSN	1043-7398
刊名	Journal of Electronic Packaging
参考译名	电子封装杂志；美国机械工程师学会汇刊
收藏年代	1995～2024

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2001, vol.123, no.1

2001, vol.123, no.2

2001, vol.123, no.3

2001, vol.123, no.4

题名

作者

出版年

年卷期

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Zs. Benedek; B. Courtois; G. Farkas; E. Kollar; S. Mir; A. Poppe; M. Rencz; V. Szekely; K. Torki

2001

2001, vol.123, no.4

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang; C. W. Chang; C. T. Lin

2001

2001, vol.123, no.4

IGBT Package Design for High Power Aircraft Electronic Systems

Farhad Sarvar; David C. Whalley; Ming K. Low

2001

2001, vol.123, no.4

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

Mohamed-Nabil Sabry

2001

2001, vol.123, no.4

Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder

V. Stolkarts; L. M. Keer; M. E. Fine

2001

2001, vol.123, no.4

Experimental Evaluation of Air-Cooling Electronics at High Altitudes

Henry Wong; Robert E. Peck

2001

2001, vol.123, no.4

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein; Lee E. Hornberger

2001

2001, vol.123, no.4

Thermal Math Modeling and Analysis of an Electronic Assembly

K. N. Shukla

2001

2001, vol.123, no.4

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys-Experiments and Constitutive Modeling

Katsuhiko Sasaki; Ken-ichi Ohguchi; Hiromasa Ishikawa

2001

2001, vol.123, no.4

Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

Ruijun Chen; Daniel F. Baldwin

2001

2001, vol.123, no.4