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期刊

ISSN	1043-7398
刊名	Journal of Electronic Packaging
参考译名	电子封装杂志；美国机械工程师学会汇刊
收藏年代	1995～2024

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2002, vol.124, no.1

2002, vol.124, no.2

2002, vol.124, no.3

2002, vol.124, no.4

题名

作者

出版年

年卷期

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Marc Hodes; Randy D. Weinstein; Stephen J. Pence; Jason M. Piccini; Lou Manzione; Calvin Chen

2002

2002, vol.124, no.4

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad; Suresh K. Sitaraman

2002

2002, vol.124, no.4

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau; Z. Mei; S. Pang; C. Amsden; J. Rayner; S. Pan

2002

2002, vol.124, no.4

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang; Y. C. Chan; K. C. Hung; P. L. Tu

2002

2002, vol.124, no.4

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan; C. P. Malhotra; R. K. Sharma

2002

2002, vol.124, no.4

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae

2002

2002, vol.124, no.4

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau; C. L. Jiaa; S. J. Erasmus

2002

2002, vol.124, no.4

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu; Robert K. Y. Li; N. H. Yeung

2002

2002, vol.124, no.4

Study of P-V-T-C Relation of EMC

Yi-San Chang; Sheng-Jye Hwang; Huei-Huang Lee; Durn-Yuan Huang

2002

2002, vol.124, no.4

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel

2002

2002, vol.124, no.4