中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2002, vol.124, no.1 2002, vol.124, no.2 2002, vol.124, no.3 2002, vol.124, no.4

题名作者出版年年卷期
Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral PassivesSwapan K. Bhattacharya; Rao R. Tummala20022002, vol.124, no.1
Thermal Management of Outdoor Electronic Cabinets Using Soil Heat ExchangersHisham E. Hegab; Eric B. Zimmerman; Gene T. Colwell20022002, vol.124, no.1
Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect StructuresNazri Kamsah; Todd S. Gross; Igor I. Tsukrov20022002, vol.124, no.1
On the Study of Piezoresistive Stress Sensors for Microelectronic PackagingBen-Je Lwo; Ching-Hsing Kao; Tung-Sheng Chen; Yao-Shing Chen20022002, vol.124, no.1
Numerical Study of Wire Bonding-Analysis of Interfacial Deformation Between Wire and PadYasuo Takahashi; Michinobu Inoue20022002, vol.124, no.1
Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array PackagesWen-Hwa Chen; Kuo-Ning Chiang; Shu-Ru Lin20022002, vol.124, no.1
Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave SolderingChia-Yu Fu; David L. McDowell; I. Charles Ume20022002, vol.124, no.1
Tunable Athermal Multi-FBG Package Using a Bending Bimetal StructureSamuel I-En Lin20022002, vol.124, no.1
Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational LoadingCemal Basaran; Rumpa Chandaroy20022002, vol.124, no.1



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