中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2002, vol.124, no.1 2002, vol.124, no.2 2002, vol.124, no.3 2002, vol.124, no.4

题名作者出版年年卷期
Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit BoardJohn H. Lau; Stephen H. Pan; Chris Chang20022002, vol.124, no.2
Nonlinear Dynamics Analysis of a Laminated Printed Wiring BoardXiaoling He; Robert E. Fulton20022002, vol.124, no.2
A New Creep Constitutive Model for Eutectic Solder AlloyX. Q. Shi; Z. P. Wang; W. Zhou; H. L. J. Pang; Q. J. Yang20022002, vol.124, no.2
A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic SoldersSung Yi; Guangxing Luo; Kerm Sin Chian20022002, vol.124, no.2
Mechanical Modeling and Characterization of the Curing Process of Underfill MaterialsL. J. Ernst; C. van't Hof; D. G. Yang; M. S. Kiasat; G. Q. Zhang; H. J. L. Bressers; J. F. J. Caers; A. W. J. den Boer; J. Janssen20022002, vol.124, no.2
Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask InterfaceTimothy Ferguson; Jianmin Qu20022002, vol.124, no.2
Birefringence Reducing Precision Replication Process Assisted by Infrared RadiationKimitoshi Sato; Yasuo Kurosaki20022002, vol.124, no.2
In-Plane Packaging Stress Measurements Through Piezoresistive SensorsBen-Je Lwo; Tung-Sheng Chen; Ching-Hsing Kao; Yu-Lin Lin20022002, vol.124, no.2
The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic PackagingE. H. Wong; R. Rajoo; S. W. Koh; T. B. Lim20022002, vol.124, no.2
Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging - Effects of Interface RoughnessQizhou Yao; Jianmin Qu20022002, vol.124, no.2
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