中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2002, vol.124, no.1 2002, vol.124, no.2 2002, vol.124, no.3 2002, vol.124, no.4

题名作者出版年年卷期
Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit BoardJohn H. Lau; Stephen H. Pan; Chris Chang20022002, vol.124, no.2
Nonlinear Dynamics Analysis of a Laminated Printed Wiring BoardXiaoling He; Robert E. Fulton20022002, vol.124, no.2
A New Creep Constitutive Model for Eutectic Solder AlloyX. Q. Shi; Z. P. Wang; W. Zhou; H. L. J. Pang; Q. J. Yang20022002, vol.124, no.2
A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic SoldersSung Yi; Guangxing Luo; Kerm Sin Chian20022002, vol.124, no.2
Mechanical Modeling and Characterization of the Curing Process of Underfill MaterialsL. J. Ernst; C. van't Hof; D. G. Yang; M. S. Kiasat; G. Q. Zhang; H. J. L. Bressers; J. F. J. Caers; A. W. J. den Boer; J. Janssen20022002, vol.124, no.2
Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask InterfaceTimothy Ferguson; Jianmin Qu20022002, vol.124, no.2
Birefringence Reducing Precision Replication Process Assisted by Infrared RadiationKimitoshi Sato; Yasuo Kurosaki20022002, vol.124, no.2
In-Plane Packaging Stress Measurements Through Piezoresistive SensorsBen-Je Lwo; Tung-Sheng Chen; Ching-Hsing Kao; Yu-Lin Lin20022002, vol.124, no.2
The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic PackagingE. H. Wong; R. Rajoo; S. W. Koh; T. B. Lim20022002, vol.124, no.2
Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging - Effects of Interface RoughnessQizhou Yao; Jianmin Qu20022002, vol.124, no.2
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024