中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2002, vol.124, no.1 2002, vol.124, no.2 2002, vol.124, no.3 2002, vol.124, no.4

题名作者出版年年卷期
Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models RevisitedC. Q. Ru20022002, vol.124, no.3
Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life PredictionRobert Darveaux20022002, vol.124, no.3
Finned Metal Foam Heat Sinks for Electronics Cooling in Forced ConvectionA. Bhattacharya; R. L. Mahajan20022002, vol.124, no.3
The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat SinkH. B. Ma; G. P. Peterson20022002, vol.124, no.3
Could Shock Tests Adequately Mimic Drop Test Conditions?E. Suhir20022002, vol.124, no.3
Shape Optimal Design of Contact Springs of Electronic ConnectorsYeh-Liang Hsu; Yuan-Chan Hsu; Ming-Sho Hsu20022002, vol.124, no.3
Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) InterconnectsJ. H. Okura; A. Dasgupta; J. F. J. M. Caers20022002, vol.124, no.3
Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact ConductanceYunsheng Xu; Xiangcheng Luo; D. D. L. Chung20022002, vol.124, no.3
Effective Local Flexural Stiffness of Ball Grid Array AssembliesJung-Chuan Lee; Mostafa Rassaian20022002, vol.124, no.3
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked ProcessorShiva P. Gadag; Susan K. Patra; Volkan Ozguz; Phillipe Marchand; Sadik Esener20022002, vol.124, no.3
123



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024