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期刊

ISSN	1043-7398
刊名	Journal of Electronic Packaging
参考译名	电子封装杂志；美国机械工程师学会汇刊
收藏年代	1995～2024

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2002, vol.124, no.1

2002, vol.124, no.2

2002, vol.124, no.3

2002, vol.124, no.4

题名

作者

出版年

年卷期

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

J. Auersperg; E. Kieselstein; A. Schubert; B. Michel

2002

2002, vol.124, no.4

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya

2002

2002, vol.124, no.4

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

John E. Ritter; G. S. Jacome; J. R. Pelch; T. P. Russell; T. J. Lardner

2002

2002, vol.124, no.4

Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)

C. L. Chung; James Fan; M. L. Huang; F. J. Tsai

2002

2002, vol.124, no.4

Experimental Investigation of Residual Stresses in Layered Materials Using Moiré Interferometry

Keith B. Bowman; David H. Mollenhauer

2002

2002, vol.124, no.4

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel; R. Kuhnert; M. Dost; B. Michel

2002

2002, vol.124, no.4

Optical Measurements of Shrinkage in UV-Cured Adhesives

A. J. Hudson; S. C. Martin; M. Hubert; J. K. Spelt

2002

2002, vol.124, no.4

Application of Ice Particles for Precision Cleaning of Sensitive Surfaces

D. V. Shishkin; E. S. Geskin; B. Goldenberg

2002

2002, vol.124, no.4

Chemical-Mechanical Planarization of Low-k Polymers for Advanced IC Structures

Christopher L. Borst; Dipto G. Thakurta; William N. Gill; Ronald J. Gutmann

2002

2002, vol.124, no.4

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel

2002

2002, vol.124, no.4