中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2003, vol.125, no.1 2003, vol.125, no.2 2003, vol.125, no.3 2003, vol.125, no.4

题名作者出版年年卷期
Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End CoolingM. M. Yovanovich20032003, vol.125, no.2
Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux ChannelsY. S. Muzychka; J. R. Culham; M. M. Yovanovich20032003, vol.125, no.2
Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned SurfacesZhe Zhang; E. E. Marotta; J. M. Ochterbeck20032003, vol.125, no.2
Thermal Interfacing Techniques for Electronic Equipment - A PerspectiveWataru Nakayama; Arthur E. Bergles20032003, vol.125, no.2
Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural ConvectionAdrian Bejan20032003, vol.125, no.2
Design of Optimum Plate-Fin Natural Convective Heat SinksAvram Bar-Cohen; Madhusudan Iyengar; Allan D. Kraus20032003, vol.125, no.2
The Case for the Elliptical SpineGerald L. McIntyre; Allan D. Kraus20032003, vol.125, no.2
Fundamental Performance Limits of HeatsinksDavid Watabe Copeland20032003, vol.125, no.2
On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components - Part I: Thermal Wake Models for Rectangular Heat SourcesAlfonso Ortega; Shankar Ramanathan20032003, vol.125, no.2
On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components - Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting PlateAlfonso Ortega; Shankar Ramanathan20032003, vol.125, no.2
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