中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2003, vol.125, no.1 2003, vol.125, no.2 2003, vol.125, no.3 2003, vol.125, no.4

题名作者出版年年卷期
Four-Terminal Measurement and Simulations for Sheet Resistance in Piezoresistive Sensing ElementsSteven Chen; J. Albert Chiou20032003, vol.125, no.4
Humidity-Induced Voltage Shift on MEMS Pressure SensorsJ. Albert Chiou; Steven Chen; Jinbao Jiao20032003, vol.125, no.4
A Vapotron Effect Application for Electronic Equipment CoolingGiulio Lorenzini; Cesare Biserni20032003, vol.125, no.4
A Board Level Study of an Array of Ball Grid Components - Aerodynamic and Thermal MeasurementsReena Cole; Mark Davies; Jeff Punch20032003, vol.125, no.4
Response Surface Modeling for Nonlinear Packaging StressesW. D. van Driel; G. Q. Zhang; J. H. J. Janssen; L. J. Ernst20032003, vol.125, no.4
Parameterized Modeling of Thermomechanical Reliability for CSP AssembliesBart Vandevelde; Eric Beyne; Kouchi (G.Q.) Zhang; Jo Caers; Dirk Vandepitte; Martine Baelmans20032003, vol.125, no.4
Residual Stresses in Multilayer Ceramic Capacitors: Measurement and ComputationJaap M. J. den Toonder; Christian W. Rademaker; Ching-Li Hu20032003, vol.125, no.4
Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic SubstrateC. J. Liu; L. J. Ernst; G. Wisse; G. Q. Zhang; M. Vervoort20032003, vol.125, no.4
Packaging Induced Die Stresses - Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding CompoundW. D. van Driel; J. H. J. Janssen; G. Q. Zhang; D. G. Yang; L. J. Ernst20032003, vol.125, no.4
Modeling the Thermal Actuation in a Thermo-Pneumatic MicropumpM. Carmona; S. Marco; J. Samitier; M. C. Acero; J. A. Plaza; J. Esteve20032003, vol.125, no.4
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