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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2004, vol.16, no.1
2004, vol.16, no.2
2004, vol.16, no.3
题名
作者
出版年
年卷期
Design for lead-free solder joint reliability of high-density packages
John Lau; Walter Dauksher; Joe Smetana; Rob Horsley; Dongkai Shangguan; Todd Castello; Irv Menis; Dave Love; Bob Sullivan
2004
2004, vol.16, no.1
Reflow profile study of the Sn-Ag-Cu solder
B. Salam; C. Virseda; H. Da; N. N. Ekere; R. Durairaj
2004
2004, vol.16, no.1
Characterization of mechanical performance of Sn/Ag/Cu solders joints with different component lead coatings
Minna Arra; Todd Castello; Dongkai Shangguan; Eero Ristolainen
2004
2004, vol.16, no.1
The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow
Timo Liukkonen; Pekka Nummenpaa; Aulis Tuominen
2004
2004, vol.16, no.1
Thermal fatigue cracking of surface mount conductive adhesive joints
Zhimin Mo; Zonghe Lai; Shiming Li; Johan Liu
2004
2004, vol.16, no.1
Design, materials and process for lead-free assembly of high-density packages
Joe Smetana; Rob Horsley; John Lau; Ken Snowdon; Dongkai Shangguan; Jerry Gleason; Irv Memis; Dave Love; Walter Dauksher; Bob Sullivan
2004
2004, vol.16, no.1
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