中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2004, vol.126, no.1 2004, vol.126, no.2 2004, vol.126, no.3 2004, vol.126, no.4

题名作者出版年年卷期
Optimal Design for PPF Heat Sinks in Electronics Cooling ApplicationsHan-Ting Chen; Jenn-Tsong Horng; Po-Li Chen; Ying-Huei Hung20042004, vol.126, no.4
Chimney Effect on Natural Air Cooling of Electronic Equipment Under InclinationYoji Kitamura; Masaru Ishizuka20042004, vol.126, no.4
Thermal Performance Optimization of Radio Frequency Packages for Wireless CommunicationVictor Adrian Chiriac; Tien-Yu Tom Lee; Vern Hause20042004, vol.126, no.4
Thermal Model of a Thinned-Die Cooling SystemN. Boiadjieva; P. Koev20042004, vol.126, no.4
A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark ModelWataru Nakayama; Ryuichi Matsuki; Yukari Hacho; Kiyoko Yajima20042004, vol.126, no.4
Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array PackagesK. Ramakrishna; T.-Y. Tom Lee20042004, vol.126, no.4
Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic ComponentsBrian H. Dennis; Zhen-xue Han; George S. Dulikravich20042004, vol.126, no.4
Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical InputsTunc Icoz; Yogesh Jaluria20042004, vol.126, no.4
Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of DevicesPrabhu Sathyamurthy; Manoj Nagulapally; Rajesh Nair20042004, vol.126, no.4
Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)M. Hernandez-Mora; J. E. Gonzalez; M. Velez-Reyes; J. M. Ortiz-Rodriguez; Y. Pang; E. Scott20042004, vol.126, no.4
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