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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2005, vol.17, no.1
2005, vol.17, no.2
2005, vol.17, no.3
2005, vol.17, no.4
题名
作者
出版年
年卷期
Effect of PCB surface finish on creep properties of lead-free solder joints
Janne J. Sundelin; Sami T. Nurmi; Toivo K. Lepisto; Eero O. Ristolainen
2005
2005, vol.17, no.4
Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling
Junling Chang; Dirk Janz; W. Kempe; Xiaoming Xie
2005
2005, vol.17, no.4
Correlation between jamming and skipping during solder paste printing
S. R. Hillman; S. H. Mannan; R. Durairaj; A. Seman; N. N. Ekere; M. Dusek; C. Hunt
2005
2005, vol.17, no.4
Investigation of the effect of solder flux residues on RF signal integrity using real circuits
David Geiger; Dongkai Shangguan
2005
2005, vol.17, no.4
Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder joints
P. Arulvanan; X. Q. Shi
2005
2005, vol.17, no.4
Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints
Peng Sun; Cristina Andersson; Xicheng Wei; Liqiang Cao; Zhaonian Cheng; Johan Liu
2005
2005, vol.17, no.4
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