中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2006, no.1sup 2006, vol.18, no.1 2006, vol.18, no.2 2006, vol.18, no.3 2006, vol.18, no.4

题名作者出版年年卷期
Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder jointPeng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu20062006, vol.18, no.2
High strain rate testing of solder interconnectionsK. T. Tsai; F.-L. Liu; E. H. Wong; R. Rajoo20062006, vol.18, no.2
Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after agingLi-Yin Hsiao; Jenq-Gong Duh20062006, vol.18, no.2
Macro-micro modelling of moisture induced stresses in an ACF flip chip assemblyC. Y. Yin; H. Lu; C. Bailey; Y. C. Chan20062006, vol.18, no.2
High performance anisotropic conductive adhesives for lead-free interconnectsYi Li; C. P. Wong20062006, vol.18, no.2
Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binderMasahiro Inoue; Katsuaki Suganuma20062006, vol.18, no.2
Finite element analysis of fleXBGA reliabilityGang Chen; Xu Chen20062006, vol.18, no.2



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