中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2007, vol.129, no.1 2007, vol.129, no.2 2007, vol.129, no.3 2007, vol.129, no.4

题名作者出版年年卷期
Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat SinksSheng-Chung Tzeng; Tzer-Ming Jeng20072007, vol.129, no.2
Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder AlloysJuan Gomez; Cemal Basaran20072007, vol.129, no.2
Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical ChannelVipin Yadav; Keshav Kant20072007, vol.129, no.2
Lifetime Estimation of Moems DevicesT. Bar-Kohany; A. Stern20072007, vol.129, no.2
A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics PackagingS. Manian Ramkumar; Krishnaswami Srihari20072007, vol.129, no.2
Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic CoolingCarlos Silva; Egidio Marotta; Leroy Fletcher20072007, vol.129, no.2
Cross-Verification of Thermal Characterization of a MicrocoolerZs. Kohari; Gy. Bognar; Gy. Horvath; A. Poppe; M. Rencz; V. Szekely20072007, vol.129, no.2
Modeling of Rotary Screw Fluid Dispensing ProcessesX. B. Chen20072007, vol.129, no.2
A Global-Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging SystemsT. Zhang; S. Rahman; K. K. Choi; K. Cho; P. Baker; M. Shakil; D. Heitkamp20072007, vol.129, no.2
Pressure Drop of Impingement Air Cooled Plate Fin Heat SinksZhipeng Duan; Y. S. Muzychka20072007, vol.129, no.2
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