中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2007, vol.129, no.1 2007, vol.129, no.2 2007, vol.129, no.3 2007, vol.129, no.4

题名作者出版年年卷期
Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal FinsD. H. Lee; Y. S. Chung; P. M. Ligrani20072007, vol.129, no.3
Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic PackagesS. Radhakrishnan; G. Subbarayan; L. Nguyen; W. Mazotti20072007, vol.129, no.3
Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical ConnectorsBrent L. Weight; Christopher A. Mattson; Spencer P. Magleby; Larry L. Howell20072007, vol.129, no.3
Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat SinkX. L. Xie; W. Q. Tao; Y. L. He20072007, vol.129, no.3
Flexible Profile Compact Thermal Models for Practical GeometriesMohamed-Nabil Sabry20072007, vol.129, no.3
Effect of RCC on the Reliability of Adhesive Flip Chip JointsLaura K. Frisk; Kati H. Kokko20072007, vol.129, no.3
Viscoelastic Influence on Dynamic Properties of PCB Under Drop ImpactFang Liu; Guang Meng; Mei Zhao20072007, vol.129, no.3
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and SimulationLeila Jannesari Ladani; Abhijit Dasgupta20072007, vol.129, no.3
Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn-37Pb SolderGang Chen; Xu Chen; Kwang Soo Kim; Mohammad Abdel-Karim; Masao Sakane20072007, vol.129, no.3
On-Wafer Capacitors Under Mechanical StressPaivi H. Karjalainen; Pekka Heino20072007, vol.129, no.3
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