中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2008, vol.130, no.1 2008, vol.130, no.2 2008, vol.130, no.3 2008, vol.130, no.4

题名作者出版年年卷期
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal LoadYan Zhang; Johan Liu; Ragnar Larsson20082008, vol.130, no.2
On Failure Mechanisms in Flip Chip Assembly - Part 2: Optimal Underfill and Interconnecting MaterialsYoonchan Oh; C. Steve Suh; Hung-Jue Sue20082008, vol.130, no.2
Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic LoadingSamson Yoon; Changsoo Jang; Bongtae Han20082008, vol.130, no.2
Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)A. D. Laws; Y. J. Chang; V. M. Bright; Y. C. Lee20082008, vol.130, no.2
On Failure Mechanisms in Flip Chip Assembly - Part 1: Short-Time Scale Wave MotionYoonchan Oh; C. Steve Suh; Hung-Jue Sue20082008, vol.130, no.2
Improved Method of CO{sub}2 Laser Cutting of Aluminum NitrideRaathai Molian; Pranav Shrotriya; Pal Molian20082008, vol.130, no.2
Board Level Drop Test Analysis Based on Modal Test and SimulationFang Liu; Guang Meng; Mei Zhao; Junfeng Zhao20082008, vol.130, no.2
Modeling of Resin Flow in Reinforced Dielectric PrepregsPavel Simacek; Suresh G. Advani; Kossi Zonvide; Leonard W. Barrett20082008, vol.130, no.2
Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics PackagingMelida Chin; S. Jack Hu; James R. Barber20082008, vol.130, no.2
Integrating Compact Thermal Models in CFD Simulations of Electronic PackagesRohit Dev Gupta; Vinayak Eswaran20082008, vol.130, no.2
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