中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2010, vol.132, no.1 2010, vol.132, no.2 2010, vol.132, no.3 2010, vol.132, no.4

题名作者出版年年卷期
Evaluation of Transverse Shear Effect on Film Delamination in Blister TestWei Wang; Yong Huang; Nicole Coutris; Hongseok Noh; Peter J. Hesketh20102010, vol.132, no.1
High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating LayerMyung Jin Yim; Yi Li; Kyoung Sik Moon; C. P. Wong20102010, vol.132, no.1
Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array ArrangementM. K. Abdullah; M. Z. Abdullah; M. A. Mujeebu; Horizon Gitano; Z. M. Ariff; R. Razali; K. A. Ahmad20102010, vol.132, no.1
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale PackagesJie-Hua Zhao; Vikas Gupta; Alok Lohia; Darvin Edwards20102010, vol.132, no.1
Electromigration Simulation for Metal LinesJianPing Jing; Lihua Liang; Guang Meng20102010, vol.132, no.1
An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated ChipCheng-Hung Huang; Wei-Lun Chang20102010, vol.132, no.1
Design of a Static TIM TesterV. Szekely; E. Kollar; G. Somlay; P. G. Szabo; M. Rencz20102010, vol.132, no.1
Numerical and Experimental Study of Interface Delamination in Flip Chip BGA PackageHu Guojun; Andrew A. O. Tay; Luan Jing-En; Ma Yiyi20102010, vol.132, no.1
Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding ProcessMasaaki Koganemaru; Toru Ikeda; Noriyuki Miyazaki; Hajime Tomokage20102010, vol.132, no.1



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024