中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
IC package development-meeting the constant challenge of changeJoe Fjelstad20102010, vol.10, no.11
LED BIN validation & traceabilityDan Hodgman20102010, vol.10, no.11
Printed electronics for flexible solid-state lightingMarc Chason20102010, vol.10, no.11
PEC (printed electronic circuit) process for LED interconnectionMike DuBois20102010, vol.10, no.11
Global electronics industry: cooler weather approachesWalt Custer; Jon Custer20102010, vol.10, no.11
Comparing electronics manufacturing transformation costs in various geographiesCharlie Barnhart20102010, vol.10, no.11
Lighting the way: LEDs in SMT productionZachery Shook20102010, vol.10, no.11
EMS provider Saline Lectronics bumps speed to meet demandTrevor Galbraith20102010, vol.10, no.11
Conformal coating & what is underneath?Bob Willis20102010, vol.10, no.11



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