中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
Black swan technologies: Game changing developments in the electronics industryJoe Fjelstad20102010, vol.10, no.7
False top coatings of a counterfeit component revealed layer by layerArt Ogg20102010, vol.10, no.7
Wafer-level solder sphere placement and its implicationsAndrew Strandjord; Thomas Oppert; Thorsten Teutsch; Ghassem Azdasht20102010, vol.10, no.7
Strong global growth throughout supply chainWalt Custer; Jon Custer-Topai20102010, vol.10, no.7
Steps toward closing the software quality gapFrederick R. Hume; Mary Beth Soloy20102010, vol.10, no.7
A history of the development of ball grid array (BGA) and column grid array (CGA) componentsWerner Engelmaier20102010, vol.10, no.7
Desoldering braid/solder wick: May he low tech but still vital in rework and repair areasBob Willis20102010, vol.10, no.7



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