中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
BGA assembly reliability - PWB quality is the keyTom Clifford20102010, vol.10, no.2
Simple solderability testing of package on package (PoP) devicesBob Willis20102010, vol.10, no.2
Technology focus: The rise of solder paste jet printingTrevor Galbraith20102010, vol.10, no.2
The HA-/HA-S (highly accelerated whatevers), beware of the unstated caveatsWerner Engelmaier20102010, vol.10, no.2
Metallization options for optimum chip-on-board assemblyMukul Luthra20102010, vol.10, no.2



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