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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2011, vol.23, no.1
2011, vol.23, no.2
2011, vol.23, no.3
2011, vol.23, no.4
题名
作者
出版年
年卷期
Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder
Aemi Nadia; A. S. M. A. Haseeb
2011
2011, vol.23, no.2
Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes
A. E. Marks; N. N. Ekere; S. Mallik; R. Bhatti
2011
2011, vol.23, no.2
Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA
Kong Hui Lee; Rob Jukna; Jim Altpeter; Kantesh Doss
2011
2011, vol.23, no.2
Stability investigations of automatic X-ray inspection systems
Istvan Latos; Mihaly Janoczki
2011
2011, vol.23, no.2
Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules
O. Nousiainen; O. Salmela; J. Putaala; T. Kangasvieri
2011
2011, vol.23, no.2
Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser module
G. Takyi; E. Amalu; P. K. Bernasko
2011
2011, vol.23, no.2
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