中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2011, vol.133, no.1 2011, vol.133, no.2 2011, vol.133, no.3 2011, vol.133, no.4

题名作者出版年年卷期
Boiling Heat Transfer and Flow Regimes in Microchannels - A Comprehensive UnderstandingTannaz Harirchian; Suresh V. Garimella20112011, vol.133, no.1
Development of Delphi-Type Compact Thermal Models for Opto-Electronic PackagesArun Prakash Raghupathy; John Janssen; Attila Aranyosi; Urmila Ghia; Karman Ghia; William Maltz20112011, vol.133, no.1
Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134aEduardo Martinez-Galvan; Juan Carlos Ramos; Raul Anton; Rahmatollah Khodabandeh20112011, vol.133, no.1
An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With NanofluidsA. Kargar; B. Ghasemi; S. M. Aminossadati20112011, vol.133, no.1
Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTsHsien-Cheng Tseng20112011, vol.133, no.1
Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging ConfigurationYuan-Chang Lin; Jiun Pyng You; Nguyen T. Tran; Yongzhi He; Frank G. Shi20112011, vol.133, no.1
Heat Transfer of an IGBT Module Integrated With a Vapor ChamberXiaoling Yu; Lianghua Zhang; Enming Zhou; Quanke Feng20112011, vol.133, no.1
Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center PerformanceSiddharth Bhopte; Bahgat Sammakia; Madhusudan Iyengar; Roger Schmidt20112011, vol.133, no.1
A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal SimulatorPaolo Emilio Bagnoli; Cristina Padovani; Andrea Pagni; Giuseppe Pasquinelli20112011, vol.133, no.1
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across CabinetThomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash20112011, vol.133, no.1
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