中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2011, vol.133, no.1 2011, vol.133, no.2 2011, vol.133, no.3 2011, vol.133, no.4

题名作者出版年年卷期
Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal ChannelJing He; Liping Liu; Anthony M. Jacobi20112011, vol.133, no.4
Two-Phase Microchannel Heat Sinks: Theory, Applications, and LimitationsIssam Mudawar20112011, vol.133, no.4
The Use of Potting Materials for Electronic-Packaging Survivability in Smart MunitionsN. H. Chao; J. A. Cordes; D. Carlucci; M. E. DeAngelis; Jyeching Lee20112011, vol.133, no.4
Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate ConnectionsPing Nicole An; Paul A. Kohl20112011, vol.133, no.4
Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger ArrangementAshish Sinha; Yogendra K. Joshi20112011, vol.133, no.4
Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent PropertiesChih-Sung Chen20112011, vol.133, no.4
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260℃Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee20112011, vol.133, no.4
Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting MediumG. Lorenzini; C. Biserni; L. A. Isoldi; E. D. dos Santos; L. A. O. Rocha20112011, vol.133, no.4
Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid MetalPeipei Li; Jing Liu20112011, vol.133, no.4
Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental ResultsA. F. Askari Farahani; M. Al-Bassyiouni; A. Dasgupta20112011, vol.133, no.4
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