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期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2005 2006 2007 2008 2009 2010
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2023 2024

2015, vol.27, no.1 2015, vol.27, no.2 2015, vol.27, no.3 2015, vol.27, no.4

题名作者出版年年卷期
IMAPS-CPMT 2014 PolandSkwarek, Agata20152015, vol.27, no.3
Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technologySitek, Janusz; Steplewski, Wojciech; Janeczek, Kamil; Koscielski, Marek; Lipiec, Krzysztof; Ciszewski, Piotr; Krzaczek, Tomasz20152015, vol.27, no.3
Materials and soldering challenges in lead-free Package-on-Package (PoP) technologyKoscielski, Marek; Sitek, Janusz; Steplewski, Wojciech; Koziol, Grazyna; Ciszewski, Piotr; Krzaczek, Tomasz20152015, vol.27, no.3
Inkjet printed microwave circuits on flexible substrates using heterophase graphene based inksFutera, Konrad; Kielbasinski, Konrad; Mlozniak, Anna; Jakubowska, Malgorzata20152015, vol.27, no.3
Investigation of treated PEN foil surface properties for inkjet applicationArazna, Aneta; Futera, Konrad; Jakubowska, Malgorzata; Dybowska-Sarapuk, Lucja20152015, vol.27, no.3
Noise sources in polymer thick-film resistorsStadler, Adam Witold; Kolek, Andrzej; Mleczko, Krzysztof; Zawislak, Zbigniew; Dziedzic, Andrzej; Steplewski, Wojciech20152015, vol.27, no.3
Influence of thermal cycling on reliability of solder joints executed on long and metal core PCBsSitek, Janusz; Arazna, Aneta; Janeczek, Kamil; Steplewski, Wojciech; Lipiec, Krzysztof; Futera, Konrad; Ciszewski, Piotr20152015, vol.27, no.3
High temperature thermogenerators made on DBC substrate using vapour phase solderingSkwarek, Agata; Synkiewicz, Beata; Kulawik, Jan; Guzdek, Piotr; Witek, Krzysztof; Tarasiuk, Jacek20152015, vol.27, no.3
IMAPS-CPMT 2014 PolandSkwarek, Agata20152015, vol.27, no.3
Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technologySitek, Janusz; Steplewski, Wojciech; Janeczek, Kamil; Koscielski, Marek; Lipiec, Krzysztof; Ciszewski, Piotr; Krzaczek, Tomasz20152015, vol.27, no.3
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