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期刊
ISSN
0913-5685
刊名
電子情報通信学会技術研究報告
参考译名
电子信息通信学会技术研究报告:可靠性
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题名
作者
出版年
年卷期
Fabrication of highly reliable Co(W) thin film by physical vapor deposition for next generation ULSI Cu interconnects
Taewoong Kim; Kouta Tomita; Takeshi Momose; Takaaki Tsunoda; Takayuki Moriwaki; Yukihiro Shimogaki
2015
2015, vol.115, no.417
Fabrication of Multilayer Graphene by Solid Phase Precipitation with Current Stress
Md. Sahab Uddin; Hiroyasu Ichikawa; Shota Sano; Kazuyoshi Ueno
2015
2015, vol.115, no.417
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
Kangwook LEE; Takafumi FUKUSHIMA; Tetsu TANAKA; Mitsumasa KOYANAGI
2015
2015, vol.115, no.417
Copper Thin Film Growth using Cu(I) Amidinate Precursor in Supercritical Carbon Dioxide
Md RASADUJJAMAN; Mitsuhiro WATANABE; Hiroshi SUDOH; Hideaki MACHIDA; Eiichi KONDOH
2015
2015, vol.115, no.417
BTA-H_2O_2溶液中におけるCu表面のその場エリプソメトリ
川上達也; 近藤英一; 渡邉満洋; 濱田聡美; 嶋昇平; 檜山浩國
2015
2015, vol.115, no.417
400万個のマイクロバンプ接続を有する1600画素3次元積層型イメージセンサの信頼性試験結果
竹本良章; 高澤直裕; 月村光弘; 齊藤晴久; 近藤亨; 加藤秀樹; 青木潤; 小林賢司; 鈴木俊介; 五味祐一; 松田成介; 只木芳隆
2015
2015, vol.115, no.417
低温作製された窒化物薄膜の特性
武山真弓; 佐藤勝; 小林靖志; 中田義弘; 中村友二; 野矢厚
2015
2015, vol.115, no.417
ラジカル処理を用いた低温TiN_x膜の特性評価
佐藤勝; 武山真弓; 野矢厚
2015
2015, vol.115, no.417
バンプレスインターコネクトを用いた三次元積層DRAM向けのウエハ薄化評価結果
金永ソク; 児玉祥一; 水島賢子; 中村友二; 前田展秀; 藤本興治; 川合章仁; 大場隆之
2015
2015, vol.115, no.417
2.5D/3D TSV用実装材料技術
満倉一行; 牧野竜也; 畠山恵一; Kenneth June REBIBIS; Andy MILLER; Eric BEYNE
2015
2015, vol.115, no.417
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