中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2016, vol.28, no.1 2016, vol.28, no.2 2016, vol.28, no.3 2016, vol.28, no.4

题名作者出版年年卷期
Method for validating CT length measurement of cracks inside solder jointsGarami, Tamas; Krammer, Oliver; Harsanyi, Gabor; Martinek, Peter20162016, vol.28, no.1
Mechanical reliability of solder joints in PCBs assembled in surface mount technologyBorecki, Janusz; Serzysko, Tomasz20162016, vol.28, no.1
IMAPS 2015 PolandSkwarek, Agata20162016, vol.28, no.1
Influence of mechanical exposures on electrical properties of thin and thick-film flexible resistors and conductorsOsypiuk, Pawel; Dziedzic, Andrzej; Steplewski, Wojciech20162016, vol.28, no.1
Mechanical properties of SMD interconnections on flexible and rigid substratesNowak, Damian; Dziedzic, Andrzej; Aluk, Zbigniew Z.; Roguszczak, Henryk; Weglarski, Mariusz20162016, vol.28, no.1
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakesIlles, Balazs; Krammer, Oliver; Geczy, Attila; Garami, Tamas20162016, vol.28, no.1
Comparative study on proper thermocouple attachment for vapour phase soldering profilingGeczy, Attila; Kvanduk, Biborka; Illes, Balazs; Harsanyi, Gabor20162016, vol.28, no.1



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