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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2016, vol.138, no.1 2016, vol.138, no.2 2016, vol.138, no.3 2016, vol.138, no.4

题名作者出版年年卷期
Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die PackagesOprins, Herman; Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Beyne, Eric20162016, vol.138, no.1
Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat RemovalBrunschwiler, Thomas; Sridhar, Arvind; Ong, Chin Lee; Schlottig, Gerd20162016, vol.138, no.1
A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural ConvectionPatankar, Gaurav; Mancin, Simone; Weibel, Justin A.; Garimella, Suresh V.; MacDonald, Mark A.20162016, vol.138, no.1
Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting ConditionsShavik, Sheikh Mohammad; Hasan, Mohammad Nasim; Morshed, A. K. M. Monjur20162016, vol.138, no.1
A Holistic Evaluation of Data Center Water Cooling Total Cost of OwnershipKamath, Vinod; Mahaney, Howard; Demetriou, Dustin W.20162016, vol.138, no.1
Gas-Liquid Flow Dispersion in Micro-Orifices and Bubble Coalescence With High Flow RatesSchirmbeck, F.; Wesholowski, J.; Kockmann, N.; Tollkoetter, A.; Reichmann, F.20162016, vol.138, no.1
Durability of Low Melt Alloys as Thermal Interface MaterialsRoy, Chandan K.; Bhavnani, Sushil; Hamilton, Michael C.; Johnson, R. Wayne; Knight, Roy W.; Harris, Daniel K.20162016, vol.138, no.1
Lid-Integral Cold-Plate Topology: Integration, Performance, and ReliabilitySchlottig, Gerd; de Fazio, Marco; Escher, Werner; Granatieri, Paola; Khanna, Vijayeshwar D.; Brunschwiler, Thomas20162016, vol.138, no.1
Influence of Secondary Impact on Printed Wiring Assemblies-Part I: High-Frequency "Breathing Mode" Deformations in the Printed Wiring BoardMeng, Jingshi; Dasgupta, Abhijit20162016, vol.138, no.1
Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor DevicesLee, Hyoungsoon; Agonafer, Damena D.; Won, Yoonjin; Houshmand, Farzad; Gorle, Catherine; Asheghi, Mehdi; Goodson, Kenneth E.20162016, vol.138, no.1
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