中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2016, vol.138, no.1 2016, vol.138, no.2 2016, vol.138, no.3 2016, vol.138, no.4

题名作者出版年年卷期
Use of a Gel Finger to Feel the Skin Temperatures of a SmartphoneSripada, Akshay; Rohlfing, Morgan; Vijaendreh, Raymond; Spetzler, Brenden; Abdulhamid, Ramsey; Porras, Aaron; Lee, Y. C.; Gupta, Ashish; Harris, Enisa20162016, vol.138, no.3
Recent Advances and New Trends in Flip Chip TechnologyLau, John H.20162016, vol.138, no.3
Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data CentersArghode, Vaibhav K.; Joshi, Yogendra20162016, vol.138, no.3
Surface and Indoor Temperature Effects on User Thermal Responses to Holding a Simulated Tablet ComputerZhang, Han; Hedge, Alan; Guo, Beiyuan20162016, vol.138, no.3
Creep Constitutive Models Suitable for Solder Alloys in Electronic AssembliesMukherjee, Subhasis; Nuhi, Mohammed; Dasgupta, Abhijit; Modarres, Mohammad20162016, vol.138, no.3
Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow VisualizationHuang, Houxue; Borhani, Navid; Thome, John Richard20162016, vol.138, no.3
Double-Layer Microchannel Heat Sinks With Transverse-Flow ConfigurationsKim, Kwang-Yong; Ansari, Danish20162016, vol.138, no.3
Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon ViaHwang, Joo-Sun; Seo, Seung-Ho; Lee, Won-Jun20162016, vol.138, no.3
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study (vol 138, 020804, 2016)Siow, K. S.; Lin, Y. T.20162016, vol.138, no.3
Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its CharacterizationGao, Yunxia; Liu, Rui; Wang, Xianping; Liu, Jing; Fang, Qianfeng20162016, vol.138, no.3
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