中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2017, vol.139, no.1 2017, vol.139, no.2 2017, vol.139, no.3 2017, vol.139, no.4

题名作者出版年年卷期
Ball Grid Array Interconnection Properties of Solderable Polymer-Solder Composites With Low-Melting-Point Alloy FillersShin, Young-Eui; Yim, Byung-Seung; Kim, Jong-Min20172017, vol.139, no.4
Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip BondingTakahashi, Yasuo; Fukuda, Hiroki; Yoneshima, Yasuhiro; Kitamura, Hideki; Maeda, Masakatsu20172017, vol.139, no.4
Effectiveness of Rack-Level Fans-Part I: Energy Savings Through ConsolidationNagendran, Bharath; Mulay, Veerendra; Agonafer, Dereje; Eiland, Richard; Fernandes, John Edward20172017, vol.139, no.4
Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked PackagesHsieh, Chi-Lung; Kung, Huang-Kuang20172017, vol.139, no.4
Effectiveness of Rack-Level Fans-Part II: Control Strategies and System RedundancyFernandes, John Edward; Eiland, Richard; Nagendran, Bharath; Mulay, Veerendra; Agonafer, Dereje20172017, vol.139, no.4
Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air SupplyWang, Cheng-Hao; Tsui, Yeng-Yung; Wang, Chi-Chuan20172017, vol.139, no.4
Determination of Energy Release Rate Through Sequential Crack ExtensionMcCann, Scott; Ostrowicki, Gregory T.; Anh Tran; Huang, Timothy; Bernhard, Tobias; Tummala, Rao R.; Sitaraman, Suresh K.20172017, vol.139, no.4
Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating ConditionsEiland, Richard; Fernandes, John Edward; Vallejo, Marianna; Siddarth, Ashwin; Agonafer, Dereje; Mulay, Verrendra20172017, vol.139, no.4
Ultraminiaturized Three-Dimensional IPAC Packages With 100 mu m Thick Glass Substrates for Radio Frequency Front-End ModulesWu, Zihan; Min, Junki; Smet, Vanessa; Pulugurtha, Markondeya Raj; Sundaram, Venky; Tummala, Rao R.20172017, vol.139, no.4
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu MicrobumpsShin, Chanho; Kim, Young-Ho; Ma, Sung Woo20172017, vol.139, no.4
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