中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1084-4309
刊名ACM Transactions on Design Automation of Electronic Systems
参考译名ACM电子系统自动化设计汇刊
收藏年代2000～2024



全部

2000 2001 2002 2003 2004 2005
2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024

2018, vol.23, no.1 2018, vol.23, no.2 2018, vol.23, no.3 2018, vol.23, no.4 2018, vol.23, no.5 2018, vol.23, no.6

题名作者出版年年卷期
Distributed Machine Learning on Smart-Gateway Network toward Real-Time Smart-Grid Energy Management with Behavior CognitionHuang, Hantao; Xu, Hang; Cai, Yuehua; Khalid, Rai Suleman; Yu, Hao20182018, vol.23, no.5
Dynamically Determined Preferred Values and a Design-for-Testability Approach for Multiplexer Select Inputs under Functional Test SequencesPomeranz, Irith20182018, vol.23, no.5
GPlace3.0: Routability-Driven Analytic Placer for UltraScale FPGA ArchitecturesAbuowaimer, Ziad; Maarouf, Dani; Martin, Timothy; Foxcroft, Jeremy; Grewal, Gary; Areibi, Shawki; Vannelli, Anthony20182018, vol.23, no.5
An Algorithmic Approach to Formally Verify an ECC LibraryKeerthi, K.; Hazra, Aritra; Rebeiro, Chester20182018, vol.23, no.5
Guiding Formal Verification Orchestration Using Machine Learning MethodsElmandouh, Eman M.; Wassal, Amr G.20182018, vol.23, no.5
Folded Circuit Synthesis: Min-Area Logic Synthesis Using Dual-Edge-Triggered Flip-FlopsHan, Inhak; Shin, Youngsoon20182018, vol.23, no.5
Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-ChipDoppa, Janardhan Rao; Pane, Partha Pratim; Chakrabarty, Krishnendu; Lee, Dongjin; Das, Sourav20182018, vol.23, no.5
Enhancing Flash Memory Reliability by Jointly Considering Write-back Pattern and Block EnduranceChen, Tseng-Yi; Chang, Yuan-Hao; Kuan, Yuan-Hung; Yang, Ming-Chang; Chang, Yu-Ming; Hsiu, Pi-Cheng20182018, vol.23, no.5
Non-Intrusive In-Situ Requirements Monitoring of Embedded SystemSeo, Minjun; Lysecky, Roman20182018, vol.23, no.5
Toward Effective Reliability Requirement Assurance for Automotive Functional SafetyXie, Guoqi; Li, Zhetao; Yuan, Na; Li, Renfa; Li, Keqin20182018, vol.23, no.5
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