中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Guest editorialSkwarek, Agata20182018, vol.30, no.2
Convection vs vapour phase reflow in LED and BGA assemblyDziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz20182018, vol.30, no.2
Investigating the attack angle of squeegees with different geometriesKrammer, Oliver; Jakab, Laszlo; Illes, Balazs; Busek, David; Pelikanova, Ivana Beshajova20182018, vol.30, no.2
Residual free solder process for fluxless solder pastesHanss, Alexander; Elger, Gordon20182018, vol.30, no.2
Effects of high current density on lead-free solder joints of chip-size passive SMD componentsGeczy, Attila; Straubinger, Daniel; Kovacs, Andras; Krammer, Oliver; Mach, Pavel; Harsanyi, Gabor20182018, vol.30, no.2
In-Bi low-temperature SLID bonding for piezoelectric materialsEggen, Trym; Manh, Tung; Hoang-Vu Nguyen; Aasmundtveit, Knut E.20182018, vol.30, no.2
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering systemIlles, Balazs; Skwarek, Agata; Geczy, Attila; Jakab, Laszlo; Busek, David; Dusek, Karel20182018, vol.30, no.2
Characterisation of Cu/Cu bonding using self-assembled monolayerLykova, Maria; Panchenko, Iuliana; Kuenzelmann, Ulrich; Reif, Johanna; Geidel, Marion; Wolf, M. Juergen; Lang, Klaus-Dieter20182018, vol.30, no.2
The influence of a soldering manner on thermal properties of LED modulesGorecki, Krzysztof; Dziurdzia, Barbara; Ptak, Przemyslaw20182018, vol.30, no.2
Fine line screen printed silver electrodes for copper electrodepositionDrabczyk, Kazimierz20182018, vol.30, no.2



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024