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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2018, vol.30, no.1
2018, vol.30, no.2
2018, vol.30, no.3
2018, vol.30, no.4
题名
作者
出版年
年卷期
Guest editorial
Skwarek, Agata
2018
2018, vol.30, no.2
Convection vs vapour phase reflow in LED and BGA assembly
Dziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz
2018
2018, vol.30, no.2
Investigating the attack angle of squeegees with different geometries
Krammer, Oliver; Jakab, Laszlo; Illes, Balazs; Busek, David; Pelikanova, Ivana Beshajova
2018
2018, vol.30, no.2
Residual free solder process for fluxless solder pastes
Hanss, Alexander; Elger, Gordon
2018
2018, vol.30, no.2
Effects of high current density on lead-free solder joints of chip-size passive SMD components
Geczy, Attila; Straubinger, Daniel; Kovacs, Andras; Krammer, Oliver; Mach, Pavel; Harsanyi, Gabor
2018
2018, vol.30, no.2
In-Bi low-temperature SLID bonding for piezoelectric materials
Eggen, Trym; Manh, Tung; Hoang-Vu Nguyen; Aasmundtveit, Knut E.
2018
2018, vol.30, no.2
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
Illes, Balazs; Skwarek, Agata; Geczy, Attila; Jakab, Laszlo; Busek, David; Dusek, Karel
2018
2018, vol.30, no.2
Characterisation of Cu/Cu bonding using self-assembled monolayer
Lykova, Maria; Panchenko, Iuliana; Kuenzelmann, Ulrich; Reif, Johanna; Geidel, Marion; Wolf, M. Juergen; Lang, Klaus-Dieter
2018
2018, vol.30, no.2
The influence of a soldering manner on thermal properties of LED modules
Gorecki, Krzysztof; Dziurdzia, Barbara; Ptak, Przemyslaw
2018
2018, vol.30, no.2
Fine line screen printed silver electrodes for copper electrodeposition
Drabczyk, Kazimierz
2018
2018, vol.30, no.2
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