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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2018, vol.30, no.1
2018, vol.30, no.2
2018, vol.30, no.3
2018, vol.30, no.4
题名
作者
出版年
年卷期
Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders
Tang, Yu; Luo, Shaoming; Li, Guoyuan; Yang, Zhou; Hou, Chaojun
2018
2018, vol.30, no.3
Effects of solder paste on thermal and optical performance of high-power ThinGaN white LED
Raypah, Muna E.; Devarajan, Mutharasu; Sulaiman, Fauziah
2018
2018, vol.30, no.3
Growth kinetics of IMC at the solid Cu/liquid Sn interface
Yin, Zuozhu; Sun, Fenglian; Liu, Yang
2018
2018, vol.30, no.3
Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach
Gharaibeh, Mohammad
2018
2018, vol.30, no.3
Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental study
Mittal, Jagjiwan; Lin, Kwang-Lung
2018
2018, vol.30, no.3
Optimising pin-in-paste technology using gradient boosted decision trees
Martinek, Peter; Krammer, Oliver
2018
2018, vol.30, no.3
Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire
Abdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, R.
2018
2018, vol.30, no.3
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