中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solderHasnine, Md20182018, vol.30, no.4
Reliability studies of InnoLot and SnBi joints soldered on DBC substrateSkwarek, Agata; Illes, Balazs; Witek, Krzysztof; Hurtony, Tamas; Tarasiuk, Jacek; Wronski, Sebastian; Synkiewicz, Beata Kinga20182018, vol.30, no.4
Bonding of Si chips to low carbon steel boards using electroplated Sn solderHsu, Shou-Jen; Lee, Chin C.20182018, vol.30, no.4
Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specificationsHuang, Chien-Yi20182018, vol.30, no.4
Solder joint inspection using eigensolder featuresWu, Hao; Xu, Xiangrong20182018, vol.30, no.4



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