中国机械工程学会生产工程分会知识服务平台

期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2019, vol.31, no.1 2019, vol.31, no.2 2019, vol.31, no.3 2019, vol.31, no.4

题名作者出版年年卷期
Transient liquid phase bonding in the Cu-Sn systemHosseinzaei, Behnam; Rashid, Ali Reza Kiani20192019, vol.31, no.4
Applying data mining methodology to establish an intelligent decision system for PCBA processHuang, Chien-Yi; Ruano, Marvin; Chen, Ching-Hsiang; Greene, Christopher20192019, vol.31, no.4
Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetryAhmad, Ibrahym; Abu Seman, Anasyida; Mohamad, Ahmad Azmin20192019, vol.31, no.4
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particlesZhang, Qiaoran; Zehri, Abdelhafid; Liu, Jiawen; Ke, Wei; Huang, Shirong; Gutierrez Latorre, Marti; Wang, Nan; Lu, Xiuzhen; Zhou, Cheng; Xia, Weijuan; Wu, Yanpei; Ye, Lilei; Liu, Johan20192019, vol.31, no.4
A method for optimizing stencil cleaning time in solder paste printing processCao, Le; Yu, JiangYou; Fu, Hao; Guo, Jun20192019, vol.31, no.4
The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressingChen, Guang; Li, Jiqiang; Kuang, Xinwen; Wu, Yaofeng; Wu, Fengshun20192019, vol.31, no.4
Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperatureAamir, Muhammad; Tolouei-Rad, Majid; Din, Israr Ud; Giasin, Khaled; Vafadar, Ana20192019, vol.31, no.4
Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phonesTang, Jie; Gong, Yi; Yang, Zhen-Guo20192019, vol.31, no.4
Study on the strength of diameter-reducing solder balls by shear and pull testsYu, Kehang; Yang, Chen; Wang, Jun; Yu, Jiabo; Yang, Yi20192019, vol.31, no.4
Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bondingGuo, Mengjiao; Sun, F.; Yin, Zuozhu20192019, vol.31, no.4



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