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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2019, vol.141, no.1
2019, vol.141, no.2
2019, vol.141, no.3
2019, vol.141, no.4
题名
作者
出版年
年卷期
Simultaneous Optimization of an Array of Heat Sinks
Karamanis, Georgios; Hodes, Marc
2019
2019, vol.141, no.2
Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
Sesek, Aleksander; Chambers, Olga; Trontelj, Janez
2019
2019, vol.141, no.2
Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics
Sirimamilla, Abhi; Ye, Hua; Wu, Yinan
2019
2019, vol.141, no.2
Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Oh, Seung Kyu; Lundh, James Spencer; Shervin, Shahab; Chatterjee, Bikramjit; Lee, Dong Kyu; Choi, Sukwon; Kwak, Joon Seop; Ryou, Jae-Hyun
2019
2019, vol.141, no.2
New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications
Chao, N. H.; Carlucci, D. E.
2019
2019, vol.141, no.2
Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
Kimura, Yasuhiro; Saka, Masumi
2019
2019, vol.141, no.2
Design of Thermal Ground Planes for Cooling of Foldable Smartphones
Nematollahisarvestani, Ali; Lewis, Ryan J.; Lee, Yung-Cheng
2019
2019, vol.141, no.2
Experimental SAC305 Shear Stress-Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
Libot, J. -B.; Alexis, J.; Dalverny, O.; Arnaud, L.; Milesi, P.; Dulondel, F.
2019
2019, vol.141, no.2
Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach
Kumar, Ritunesh; Singh, Gurjeet; Mikielewicz, Dariusz
2019
2019, vol.141, no.2
Reliability Considerations for Oil Immersion-Cooled Data Centers
Shah, Jimil M.; Eiland, Richard; Rajmane, Pavan; Siddarth, Ashwin; Agonafer, Dereje; Mulay, Veerendra
2019
2019, vol.141, no.2
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