中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2019, vol.141, no.1 2019, vol.141, no.2 2019, vol.141, no.3 2019, vol.141, no.4

题名作者出版年年卷期
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes PackagingYu, Xingjian; Hu, Run; Wu, Ruikang; Xie, Bin; Zhang, Xiaoyu; Luo, Xiaobing20192019, vol.141, no.3
Evaporative Wicking Phenomena on Nanotextured SurfacesDuong Vy Le; Pham, Quang N.; Lee, Jonggyu; Zhang, Shiwei; Won, Yoonjin20192019, vol.141, no.3
Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat ExchangerZhu, Hua; Yang, Zhuo; Khan, Tariq Amin; Li, Wei; Sun, Zhijian; Du, Jincai; Zhang, Zhengjiang; Zhou, Jianxin20192019, vol.141, no.3
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip StructureXie, Bin; Liu, Haochen; Sun, Xiao Wei; Yu, Xingjian; Wu, Ruikang; Wang, Kai; Luo, Xiaobing20192019, vol.141, no.3
Orientation Effects in Two-Phase Microgap FlowRobinson, Franklin L.; Bar-Cohen, Avram20192019, vol.141, no.3
Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional SimulationMarek, Juraj; Cernaj, L'ubos; Donoval, Daniel; Kovac, Jaroslav; Dua, Christian; Delage, Sylvain L.; Jacquet, Jean-Claude; Chvala, Ales; Szobolovszky, Robert; Kovac, Jaroslav, Jr.; Florovic, Martin20192019, vol.141, no.3
Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package ModuleLu, Mei-Chien20192019, vol.141, no.3
Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit TemperaturesNakajo, Yusuke; Athavale, Jayati; Yoda, Minami; Joshi, Yogendra; Nishi, Hiroaki20192019, vol.141, no.3
Special Issue on InterPACK 2018Dede, Ercan M.; Boteler, Lauren; Chen, Changqing; Gromala, Przemyslaw Jakub; Leever, Benjamin; Li, Wei20192019, vol.141, no.3
Impact of Server Thermal Design on the Cooling Efficiency: Chassis DesignKhalili, Sadegh; Alissa, Husam; Nemati, Kourosh; Seymour, Mark; Curtis, Robert; Moss, David; Sammakia, Bahgat20192019, vol.141, no.3
12