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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999～2024
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2020, vol.32, no.1
2020, vol.32, no.2
2020, vol.32, no.3
2020, vol.32, no.4
题名
作者
出版年
年卷期
Selective etching and hardness properties of quenched SAC305 solder joints
Kheawhom, Soorathep; Illes, Balazs; Mohd Nazeri, Muhammad Firdaus; Mohamad, Ahmad Azmin; Salleh, Nor Azmira; Yahaya, Muhamad Zamri
2020
2020, vol.32, no.4
Low-voiding solder pastes in LED assembly
Dziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz; Wronski, Sebastian
2020
2020, vol.32, no.4
Impact of convection on thermographic analysis of silver based thermal joints
Stojek, Krzysztof Jakub; Felba, Jan; Nicolics, Johann; Wolczynski, Dominik
2020
2020, vol.32, no.4
Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing
Krammer, Oliver; Al-Ma'aiteh, Tareq, I; Illes, Balazs; Busek, David; Dusek, Karel
2020
2020, vol.32, no.4
Structural characterization of inkjet printed capacitor layers in various technological conditions
Kiliszkiewicz, Milena; Przybylski, Dariusz; Felba, Jan; Korbutowicz, Ryszard
2020
2020, vol.32, no.4
IMAPS 2019 Poland
Skwarek, Agata
2020
2020, vol.32, no.4
The influence of soldering process parameters on the optical and thermal properties of power LEDs
Ptak, Przemyslaw; Gorecki, Krzysztof; Skwarek, Agata; Witek, Krzysztof; Tarasiuk, Jacek
2020
2020, vol.32, no.4
Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
Alaya, Mohamed Amine; Megyeri, Viktoria; Busek, David; Harsanyi, Gabor; Geczy, Attila
2020
2020, vol.32, no.4
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
Straubinger, Daniel; Bozsoki, Istvan; Illes, Balazs; Krammer, Oliver; Busek, David; Geczy, Attila
2020
2020, vol.32, no.4
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