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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2020, vol.142, no.1 2020, vol.142, no.2 2020, vol.142, no.3 2020, vol.142, no.4

题名作者出版年年卷期
An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology LoadsKhalili, Sadegh; Rangarajan, Srikanth; Gektin, Vadim; Alissa, Husam; Sammakia, Bahgat20202020, vol.142, no.4
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle ChargerTayyara, Omri; Silva, Carlos Da; Nasr, Miad; Assadi, Amir; Gupta, Kshitij; Trescases, Olivier; Amon, Cristina H.20202020, vol.142, no.4
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics CoolingChristidis, Pavolas N.; Vayas Tobar, Nicolas; Talmor, Michal; Yagoobi, Jamal; Castaneda, Alexander J.; O'Connor, Nathaniel J.20202020, vol.142, no.4
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and OptimizationWhitt, Reece; Huitink, David; Yuan, Zhao; Emon, Asif; Luo, Fang; Hudson, Skyler20202020, vol.142, no.4
Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated CircuitsRangarajan, Srikanth; Hadad, Yaser; Choobineh, Leila; Sammakia, Bahgat20202020, vol.142, no.4
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive LoadsDale, Travis; Singh, Yuvraj; Bernander, Ian; Subbarayan, Ganesh; Handwerker, Carol; Su, Peng; Glasauer, Bernard20202020, vol.142, no.4
A System to Package Perspective on Transient Thermal Management of Electronicsde Bock, H. Peter; Huitink, David; Shamberger, Patrick; Lundh, James Spencer; Choi, Sukwon; Niedbalski, Nicholas; Boteler, Lauren20202020, vol.142, no.4
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride SubstratesSong, Yiwen; Lundh, James Spencer; Wang, Weijie; Leach, Jacob H.; Eichfeld, Devon; Krishnan, Anusha; Perez, Carlos; Ji, Dong; Borman, Trent; Ferri, Kevin; Maria, Jon-Paul; Chowdhury, Srabanti; Foley, Brian M.; Choi, Sukwon; Ryou, Jae-Hyun20202020, vol.142, no.4
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change MaterialsNafis, Bakhtiyar Mohammad; Iradukunda, Ange-Christian; Huitink, David20202020, vol.142, no.4
Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body MeasurementsLall, Pradeep; Yadav, Vikas; Narangaparambil, Jinesh; Liu, Wei; Thomas, Tony20202020, vol.142, no.4
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