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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2021, vol.33, no.1
2021, vol.33, no.2
2021, vol.33, no.3
2021, vol.33, no.4
2021, vol.33, no.5
题名
作者
出版年
年卷期
Optimized cerium addition for microstructure and mechanical properties of SAC305
Muhammad, Riaz; Ali, Umair
2021
2021, vol.33, no.4
Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana
Nyarko, Frank Kwabena Afriyie; Takyi, G.
2021
2021, vol.33, no.4
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature
Gan, Gui-sheng; Jiang, Liujie; Chen, Shiqi; Deng, Yongqiang; Yang, Donghua; Jiang, Zhaoqi; Tian, Mizhe; Xu, Qianzhu; Liu, Xin; Cao, Huadong
2021
2021, vol.33, no.4
Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints
Han, Xu; Li, Xiaoyan; Yao, Peng; Chen, Dalong
2021
2021, vol.33, no.4
Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders
Lin, Chung-Yung
2021
2021, vol.33, no.4
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems
Siswanto, Waluyo Adi; Borodin, Kirill; Mahmoud, Zaid Hamid; Surendar, A.; Sajjadifar, Sami; Abdilova, Galiya; Chang, Jun
2021
2021, vol.33, no.4
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