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期刊
ISSN
0954-0911
刊名
Soldering & Surface Mount Technology
参考译名
焊接与表面固定技术
收藏年代
1999~2024
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2021, vol.33, no.1
2021, vol.33, no.2
2021, vol.33, no.3
2021, vol.33, no.4
2021, vol.33, no.5
题名
作者
出版年
年卷期
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
Ekpu, Mathias
2021
2021, vol.33, no.5
Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes
Raypah, Muna E.; Devarajan, Mutharasu; Mahmud, Shahrom
2021
2021, vol.33, no.5
Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding
Sun, F.; Pan, Zhen; Liu, Yang; Li, Xiang; Liu, Haoyu; Li, Wenpeng
2021
2021, vol.33, no.5
Simulation of jet printing of solder paste for surface mounted technology
Martensson, Gustaf Eric; Gohl, Johan; Mark, Andreas
2021
2021, vol.33, no.5
Surface energetic-based analytical filling time model for flip-chip underfill process
Ng, Fei Chong; Abas, Mohamad Aizat
2021
2021, vol.33, no.5
Detection of solder paste defects with an optimization-based deep learning model using image processing techniques
Sezer, Au; Altan, Aytac
2021
2021, vol.33, no.5
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