中国机械工程学会生产工程分会知识服务平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2021, vol.143, no.1 2021, vol.143, no.2 2021, vol.143, no.3 2021, vol.143, no.4

题名作者出版年年卷期
Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite SystemsIsaacs, Steven A.; Lapointe, Caelan; Hamlington, Peter E.20212021, vol.143, no.1
An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest SupercomputerYuksel, Anil; Mahaney, Vic; Marroquin, Chris; Tian, Shurong; Hoffmeyer, Mark; Schultz, Mark; Takken, Todd20212021, vol.143, no.1
A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow MicrochannelChen, Zengchao; Li, Wei; Li, Junye; Zhou, Kan; Feng, Zhaozan20212021, vol.143, no.1
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder JointJian, Minghong; Su, Sinan; Hamasha, Sa'd; Hamasha, Mohammad M.; Alkhazali, Atif20212021, vol.143, no.1
Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics CoolingLi, Yongtong; Gong, Liang; Xu, Minghai; Joshi, Yogendra20212021, vol.143, no.1
Thermal Analysis and Optimization of Light-Emitting Diodes Filament LampLiu, Jie; Zou, Jinglong; Liu, Sheng20212021, vol.143, no.1
Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration LoadsLall, Pradeep; Thomas, Tony20212021, vol.143, no.1
Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive EvaluationLi, Guoyi; Lee, Hyunseong; Chattopadhyay, Aditi; Kumar Neerukatti, Rajesh; Liu, Kuang C.20212021, vol.143, no.1
Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding CompoundLi, Ruifeng; Yang, Daoguo; Zhang, Ping; Niu, Fanfan; Cai, Miao; Zhang, G. Q.20212021, vol.143, no.1
Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic PackagingAndre, John S.; Ji, Karen; Chen, Zhan; Ulrich, Nathan20212021, vol.143, no.1
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